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Genesis / Datori un piederumi

THERMAL PASTE GENESIS SILICON 900 8G

Ražotāja kods: NTG-2330

THERMAL PASTE GENESIS SILICON 900 8G

Apraksts

Features Thermal conductivity: 12.8 W/m·K Density: 2.8 g/cm³ Temperature range (operation): -50 - 250 °C Model: Thermal paste Weight and dimensions Product weight: 8 g Packaging data Spatula: Yes Quantity: 1

Category
Computers and accessories
Department
Electronics
Weight (kg)
1